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T12 Thermal Paste Processor 3G 12.8W/K CPU Cooler Silicone Plaster
ر.ع. OMR
ر.ع.1.899
Description
Thermal Conductivity: A thermal conductivity of >12.8 W/M-k ensures efficient heat dissipation, enhancing the performance and longevity of your CPU and chipset.
Operation Temperature: With an operating temperature range of -30 to 280 ℃, this thermal paste can be used in a wide variety of environments, ensuring reliable performance under extreme conditions.
Product Specifications: TISHRIC Thermal Plaster / Expansion Board (Model: TSR262)
Key Attributes & Technical Specs
| Attribute | Details |
| Brand Name | TISHRIC |
| Type | Conductive Heatsink Plaster |
| Application | Chip |
| Color | Grey |
| Net Weight | 3 g |
| Thermal Conductivity | > 12.8 W/m-K |
| Power | 12.8 W/K |
| Thermal Impedance | < 0.002 ℃-in/W |
| Viscosity | 73 CPS |
| Dielectric Constant A | > 5.1 |
| Operating Temperature | -30 to 280 ℃ |
Additional information
| Weight | 0.045 kg |
|---|---|
| Dimensions | 15 × 10 × 1.5 cm |
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